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Physical Vapor Deposition (PVD) Systems

2 x Univac (Korea) Sputtering Machines

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Features

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Dimension: Dia. 1400 mm. ◊ Height 1630 mm.

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Magnetron sputtering target (3ea).

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DC pulse power supply for sputtering (20kW, 30kHz).

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Linear type ion source.

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DC power supply for ion source (5kW, normal).

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Low vacuum pump (Rotary & Booster pump).

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Vacuum gauge (2 Low & 1 High range).

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Deposition control by XTC according to deposition time.

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Gas flow by MFC (2 Ar, 2 O2 each).

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Heating system by micro heater.

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PC-based system controller.

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Cooling system (Polycold). High vacuum pump (Oil diffusion pump, 22"◊2 ea/option : Turbo molecule)

Benefits

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Reducing of pumping time by using effective Univac's oil diffusion pump.

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Excellent uniformity & maximum production yields.

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Easy operation & maintenance.

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PC-based effective automatic system control for coating process.

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Increased film adhesion.

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Low temperature coating process available.

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Various color deposition according to used material.

 This sputtering system is equipped with 3 targets, also known as cathodes, and 1 linear type DC Ion Source for pretreatment. These parts are located at the left and right sides of the machine on pairs. In order to improve production yield, it consist of Univacís large capacity oil diffusion pumps with faster pumping time and 2 batch type doors with revolution-rotation substrate holders. Effective automatic system control enables easy coating process and excellent products. Ar is the primary gas used to sputter atoms from the targets and O2 is used for reactive sputtering to adjust stereochemistry of oxides, if needed.

 Application of an axial magnetic field increase the path length of the electron because electrons execute longer helical path orbits before they reach the anode. The magnetic field helps the electrons to stay away from the walls of the sputtering chamber, thereby reducing the losses of electrons due to recombination process at the walls. In a combined electric and magnetic fields, the electrons remain in a trap near the target, so that they increase their ionizing effect. Magnetron configurations eliminate the path of the electrons going to the walls or to the substrate. Magnetrons, the sputtering sources with magnetic confinement of electrons, greatly enhance the capability of the sputtering process by increasing ionization process. Magnetron sputtering achieves high deposition rates.

 

702 Tolstoy House, Tolstoy Marg, New Delhi 110001, INDIA
Phone: +91 (11) 2371-5517, Fax: +91 (11) 2371-2032
info@specialsteelco.com
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